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  • Elpida FA164A2PM - The same 2 GB RAM package we found in the HTC One (M8), and different from the 2 GB Samsung chip found in Chipworks' analysis. Quad-core 2.5 GHz CPU likely layered beneath
  • Samsung KLMAG2GEAC-B0 16 GB on-board memory
  • Avago ACPM-7617 multi-mode, multi-band RF front end
  • Murata KM4220004 (likely Wi-Fi module)
  • C1N75R UMR3
  • Maxim Integrated MAX77804K (System PSoC) and MAX77826
  • STMicroelectronics 32A M410





    • SWEP GRG28 antenna switch module (thanksChipworks)
    • Qualcomm WTR1625L RF transceiver (another encore from the HTC One M8) and...
    • Qualcomm WFR1620 receive-only companion chip
    • Qualcomm PMC8974
    • Lattice LP1KSD 84071R25
    • Invensense MP65M gyroscope/accelerometer
    • Qualcomm WCD9320 audio codec
    • SIMG 8240B0 mobile HD-link transmitter and NXP 47803 NFC controller



      • Cypress CY8C20075-24LKXI CapSense capacitive touch-sensing controller
      • RF1119

        ဒီပုိ႔စ္ကုိ pdf အေနနဲ႔ သိမ္းထားခ်င္တယ္ဆုိရင္ေတာ့ ေအာက္ကေပးထားတဲ့ လင့္ကေနတစ္ဆင့္ေဒါင္းႏုိင္ပါတယ္ ခင္ဗ်ာ။

        Download Here (S5 Disassemble PDF)  


    PDF file password = koaung

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